Integrated circuit package

Details Integrated circuit package Integrated circuit package

2011-04-12

2011-04-12

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

C257S666000, C257S673000, C257SE23031, C257SE23042, C257SE23043

Reexamination Certificate

active

07923825

ABSTRACT:
An integrated circuit package is described that includes an integrated circuit die, a plurality of lower contact leads, and an insulating substrate positioned over the die and lower contact leads. The insulating substrate includes a plurality of electrically conducting upper routing traces formed on the bottom surface of the substrate. The traces on the bottom surface of the substrate electrically couple each lower contact lead with an associated I/O pad.

REFERENCES:
patent: 5530282 (1996-06-01), Tsuji
patent: 6781243 (2004-08-01), Li et al.
patent: 7102209 (2006-09-01), Bayan et al.
patent: 2007/0132075 (2007-06-01), Masumoto

Affiliated with

Also associated with

Rating

Integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2741818