Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Patent
1994-12-28
1996-02-13
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Small lead frame for connecting a large lead frame to a...
257676, 257670, 257725, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
054913608
ABSTRACT:
An electric packaging arrangement for isolated circuits is described. A lead frame is formed with at least one off-centered tie bar connected between one of the circuits on the lead frame's internal lead and an external handling side rail. The tie bar is off-centered by a specified distance from the longitudinal center line of the package. The external side rail is used to support and align the lead frame during manufacturing. To meet safety requirements, such as the UL-1950 requirements, electrical components in a primary circuit and a secondary circuit are attached and electrically coupled to the lead frame in a manner such that the smallest internal distance between internal circuits is at least a predefined distance. The external distance between the tie bar, connected to the secondary circuit, and the closest primary circuit pin is set to meet external circuit component spacing requirements for isolated circuits. The described arrangement has a number of applications including packaging isolated circuits using small form factor packages such as dual-in-line (DIP) and small outline (SO) packages.
REFERENCES:
patent: 4780795 (1988-10-01), Meinel
patent: 5313095 (1994-05-01), Togawa et al.
Hille Rolf
National Semiconductor Corporation
Williams Alexander Oscar
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