Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate
2005-02-01
2005-02-01
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Small lead frame for connecting a large lead frame to a...
C257S676000
Reexamination Certificate
active
06849931
ABSTRACT:
A lead frame for semiconductor electronic parts with a landed semiconductor chip has a body part formed with a molding resin by landing the semiconductor chip on an island, connecting a plurality of leads to respective electrode pads of the semiconductor chip via conductors and sealing the semiconductor chip with the molding resin and a junction to a mounted board formed by exposing the lower faces of the leads to the lower face of the body. Recessed mold resin engaging cavities are provided at both side faces of each of the leads. Otherwise, each of the leads is formed in inverted trapezoidal cross section, with its upper face being wider than its lower face. Protruded thrust extension members which make the lower faces of the leads extend to the extending direction of the leads and which are thinner than the leads are provided at the end of each of the leads.
REFERENCES:
patent: 5753535 (1998-05-01), Ebihara
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6483178 (2002-11-01), Chuang
patent: 6548328 (2003-04-01), Sakamoto et al.
patent: 20020121684 (2002-09-01), Kobayakawa
Cao Phat X.
Jordan and Hamburg LLP
Rohm & Co., Ltd.
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