Composite lead frame with connected inner and outer leads

Details Composite lead frame with connected inner and outer leads Composite lead frame with connected inner and outer leads

1992-09-09

1994-07-05

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257673, H01L 2348

Patent

active

053269900

ABSTRACT:
An outer lead of a metal lead frame is connected to an inner lead of a flexible lead-patterned substrate via a Au-Sn alloy layer. The Au-Sn alloy layer contains Au of 10 to 40 weight %.
An inner lead of a metal lead frame is connected to a patterned lead of a flexible lead-patterned substrate by a heating tool. The inner lead is coated on bottom and side surfaces of its tip portion. The bottom surface faces the patterned lead.

REFERENCES:
patent: 4390598 (1983-06-01), Phy
patent: 4800419 (1989-01-01), Long et al.

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