Composite lead frame

Details Composite lead frame Composite lead frame

1992-01-08

1993-05-18

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257666, H01L 2348

Patent

active

052124053

ABSTRACT:
A composite lead frame in which an island formed with a greater diameter than that of a semiconductor device to be mounted is attached to a lead frame main body having leads being integrally protruded inward, the top ends of the leads are bonded with corresponding fine leads of the island at one ends thereof and lead terminals of the semiconductor device are connected respectively to the other ends of the corresponding fine leads, wherein the composite lead frame comprises an insulating sheet appended on one surface of the island and having the fine leads secured thereto being protruded outward and through holes disposed discretely passing through the insulating sheet and the island so that the wire bonding portions at the other ends of the fine leads are exposed.

REFERENCES:
patent: 4949158 (1990-08-01), Ueda
patent: 5016084 (1991-05-01), Nakao
patent: 5095359 (1992-03-01), Tanaka et al.

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