Flip-chip on flex for high performance packaging applications
Ground plane for plastic encapsulated integrated circuit die pac
High density integrated circuit package assembly with a heatsink
High density stackable and flexible substrate-based...
High power dissipating tape ball grid array package
IC carrier
IC substrate having over voltage protection function
IC substrate with over voltage protection function
Inlet for an electronic tag
Inorganic chip-to-package interconnection circuit
Integrated circuit assembly incorporating an anisotropic elecctr
Integrated circuit chip carrier
Integrated circuit chip placement in a high density interconnect
Integrated circuit device packages and substrates for making...
Integrated circuit device packages and substrates for making...
Integrated circuit device packages and substrates for making...
Integrated circuit package and method
Integrated circuit with on-chip ground base
Interdigitated wirebond programmable fixed voltage planes
Interposer connecting leadframe and integrated circuit