Integrated circuit with on-chip ground base

Details Integrated circuit with on-chip ground base Integrated circuit with on-chip ground base

1997-06-02

1999-04-06

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257701, 257728, 257737, 257780, H01L 23495, H01L 23053, H01L 2334, H01L 2348

Patent

active

058922725

ABSTRACT:
An integrated circuit includes a ground plane structure which provides a uniform ground potential throughout the integrated circuit and improves its performance. The ground plane structure is carried atop the active circuit elements of the integrated circuit and connects with each of the ground-potential contact pads of the circuit. A method of making the integrated circuit includes applying a ground plane precursor structure over all of the integrated circuit topology, and removing portions of the precursor structure where the ground plane is not desired. A method of providing bump structures at each of the contact pads for use in TAB bonding of the electrical connections of the integrated circuit to a package structure is also set forth.

REFERENCES:
patent: 4837609 (1989-06-01), Gurvitch et al.
patent: 5021300 (1991-06-01), Stacey
patent: 5027189 (1991-06-01), Shannon et al.
patent: 5036379 (1991-07-01), Smith et al.
patent: 5072520 (1991-12-01), Nelson
patent: 5099306 (1992-03-01), Dunaway et al.
patent: 5331204 (1994-07-01), Kuroda et al.

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