Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1993-10-04
1995-06-06
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257676, 257700, 257721, 257725, 257707, 257711, 257758, H01L 23485, H01L 2944, H01L 2952, H01L 2960
Patent
active
054225132
ABSTRACT:
A high density interconnect (HDI) structure having a dielectric multi-layer interconnect structure on a substrate is fabricated by forming a chip well, placing a chip in the well, and connecting the chip to the interconnect structure. Additionally, temperature sensitive chips or devices may be located beneath the dielectric multi-layer interconnect structure. A spacer die may be located in the substrate while the interconnect structure is fabricated and removed after a chip well aligned with the spacer die is formed, in order to accommodate a chip thickness which is greater than the dielectric multi-layer interconnect structure thickness.
REFERENCES:
patent: 3591838 (1971-07-01), Fujiwara et al.
patent: 3903590 (1975-09-01), Yokogawa
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 5047834 (1991-09-01), Kovac et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5154793 (1992-10-01), Wojnarowski et al.
Fillion Raymond A.
Marcinkiewicz Walter M.
Whitmore Barry S.
Wojnarowski Robert J.
Jackson Jerome
Krauss Geoffrey H.
Martin Marietta Corporation
Tang Alice W.
LandOfFree
Integrated circuit chip placement in a high density interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit chip placement in a high density interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit chip placement in a high density interconnect will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-989389