Inorganic chip-to-package interconnection circuit

Details Inorganic chip-to-package interconnection circuit Inorganic chip-to-package interconnection circuit

1994-09-09

1996-04-30

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257670, 257671, 257690, H01L 23495, H01L 2348

Patent

active

055127800

ABSTRACT:
An inorganic chip-to-package interconnection circuit is described. The circuit has a set of electrical conductors that are held together by a set of insulating inorganic tie bars. The circuit constitutes a high-density chip-to-package interconnection circuit that does not absorb vapor or volatile gases. A variety of methods for forming the circuit are described. Advantageously, the methods utilize known processing techniques.

REFERENCES:
patent: 4180828 (1979-12-01), Schermer et al.
patent: 4721994 (1988-01-01), Mine et al.
patent: 4732801 (1988-03-01), Joshi
patent: 4733292 (1988-03-01), Jarvis
patent: 4805420 (1989-02-01), Porter et al.
patent: 5036163 (1991-07-01), Spielberger et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5343074 (1994-08-01), Higgins
patent: 5362985 (1995-11-01), Ma et al.

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