Integrated circuit package and method

Details Integrated circuit package and method Integrated circuit package and method

2007-08-07

2007-08-07

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257SE23060, C257SE23062, C257SE23016, C257SE23004, C257SE23067, C257S700000, C257S701000, C257S702000, C257S703000, C257S778000, C257S738000, C257S737000, C257S734000, C257S758000, C174S262000, C361S792000

Reexamination Certificate

active

11010784

ABSTRACT:
An integrated circuit package includes a substrate having a central axis dividing the substrate into an upper half and a lower half and an integrated circuit coupled to the substrate. A layer is provided within the substrate in the lower half thereof that is configured to resist warpage of the integrated circuit package, the layer provided a distance from the central axis.

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