Interdigitated wirebond programmable fixed voltage planes

Details Interdigitated wirebond programmable fixed voltage planes Interdigitated wirebond programmable fixed voltage planes

1996-07-29

1997-09-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257692, 257700, 361794, 361792, H01L 2328

Patent

active

056729090

ABSTRACT:
Two interdigitated comb-shaped fixed voltage buses such as a power bus and ground bus, in the form of metallization are provided substantially encircling of an integrated circuit die in an integrated circuit package or other integrated die assembly. Any selection of bonding pads on the die and metallization leads in the assembly may be connected to the fingers of either bus. The length of wire bond or TAB connections and the area occupied by the buses is minimized by the interdigitated geometry of the buses.

REFERENCES:
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patent: 5173767 (1992-12-01), Lange et al.
patent: 5225709 (1993-07-01), Nishiuma et al.
patent: 5294751 (1994-03-01), Kamada
patent: 5329156 (1994-07-01), Bartlow
patent: 5343074 (1994-08-01), Higgins, III et al.
patent: 5402318 (1995-03-01), Otsuka et al.
patent: 5457340 (1995-10-01), Templeton, Jr. et al.
patent: 5497031 (1996-03-01), Kozono

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