Integrated circuit assembly incorporating an anisotropic elecctr

Details Integrated circuit assembly incorporating an anisotropic elecctr Integrated circuit assembly incorporating an anisotropic elecctr

1995-07-17

1997-05-06

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257693, 257697, 257778, 361760, 361767, H01L 2348

Patent

active

056274050

ABSTRACT:
An integrated circuit assembly includes an integrated circuit chip having a plurality of input/output terminals arranged at a surface thereof, and an electrically conductive layer connected to such surface of the integrated circuit chip. The layer is electrically conductive in thickness and electrically insulative in width and length. The assembly may further include a dielectric substrate connected to the layer such that the layer electrically connects respective terminals of the integrated circuit chip to respective electrically conductive traces of the dielectric substrate. An array of contacts may be electrically connected to the traces of the dielectric substrate.

REFERENCES:
patent: 4832455 (1989-05-01), Takeno et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 5014161 (1991-05-01), Lee et al.
patent: 5225966 (1993-07-01), Basavanhally et al.
patent: 5289346 (1994-02-01), Carey et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5318651 (1994-06-01), Matsui et al.
Hitachi Chemical Co., Ltd, Hitachi Anisotropic Conductive Film, Anisolm.RTM., Tokyo, Japan.

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