Integrated circuit chip carrier

Details Integrated circuit chip carrier Integrated circuit chip carrier

1992-06-12

1994-03-08

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257673, 257698, 257730, H01L 2302, H01L 2312

Patent

active

052930670

ABSTRACT:
An integrated circuit chip carrier assembly, comprising a semiconductor device (10) having interconnection pads (14) disposed on an active surface (12) of the device. The device (10) is attached by means of electrically conducting bumps (26) to a circuitry pattern (18) on a first side of a circuit carrying substrate (16). The substrate is typically an aramid reinforced organic resin, such as epoxy. The circuitry (18, 20) is electrically connected by conductive through-holes (22) to an array of solder pads on a second side of the substrate. Some or all of the through-holes (22) are covered by the device. The overall length and width of the circuit carrying substrate (16) are each a maximum of about 0.15 inches greater than the equivalent dimensions of the device (10), creating a carrier that is only slightly larger than the semiconductor device itself.

REFERENCES:
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4933810 (1990-06-01), Cardashian et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 4963414 (1990-10-01), LeVasseur et al.

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