Process of grounding heat spreader/stiffener to a flip chip...
Process to prevent stress cracking of dielectric films on...
Processes and apparatus for lift-off and bonding of materials an
Production method for an IC card and its IC card
Production of an electrical component and component
Programmable multi-chip module
Programmable multi-chip module
Programmable sensor array
Programmed material consolidation methods for fabricating...
Protected bond fingers
Protection and packaging system for semiconductor devices
Protective device for subassemblies and method for producing...
Protective device with spacer for subassemblies
Protective layer for a semiconductor device
Protective structure for bond wires
Protective structures for bond wires
Providing additional space between an integrated circuit and...
Push-in type semiconductor device including heat spreader
Pyroelectric sensor