Production method for an IC card and its IC card

Details Production method for an IC card and its IC card Production method for an IC card and its IC card

1991-07-09

1993-12-21

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257678, 257680, H01L 2302, H01L 2312

Patent

active

052723747

ABSTRACT:
An IC card comprises a card board having first and second major surfaces and a semiconductor module having an electrode terminal face. The semiconductor module is mounted in the card board, so that the electrode terminal face is exposed onto the first major surface of the card board. The card board comprises a board frame and a resin which is molded inside the board frame. Part of the semiconductor module surface which is opposite to the electrode terminal face, is covered with the resin.

REFERENCES:
patent: 3548267 (1970-12-01), Siddell et al.
patent: 4483067 (1984-11-01), Parmentier
patent: 4649418 (1987-03-01), Uden
patent: 4754319 (1988-06-01), Saito et al.
patent: 4766480 (1988-08-01), Hamada
patent: 4916522 (1990-04-01), Cohn
patent: 4931853 (1990-06-01), Ohuchi et al.

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