Protective device with spacer for subassemblies

Details Protective device with spacer for subassemblies Protective device with spacer for subassemblies

2005-08-09

2005-08-09

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S710000, C257S738000, C257S778000, C257S779000

Reexamination Certificate

active

06927487

ABSTRACT:
A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The protective device includes a covering element, a spacer, and a guide. The covering element covers a subassembly. The spacer is disposed between the covering element and the substrate for maintaining a predefined spacing between the covering element and the component to be protected in the area of the spacer. The guide is used for fixing a free end of the spacer to the covering element and/or to the substrate in a predefined X and/or Y position.

REFERENCES:
patent: 5777847 (1998-07-01), Tokuno et al.
patent: 6268236 (2001-07-01), Miyawaki
patent: 6294408 (2001-09-01), Edwards et al.
patent: 37 01 310 (1988-07-01), None
patent: 198 06 017 (1998-09-01), None
patent: 1 093 159 (2001-04-01), None
patent: 2000 299 396 (2000-10-01), None
Author not listed: “Functional Island Attachment to Molded Card”, IBM Corp., vol. 32, No. 4B, Sep. 1989, p. 138.

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