Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1994-02-15
1995-11-07
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, H01L 2316, H01L 3902
Patent
active
054650097
ABSTRACT:
Novel processes and apparatus permit lift-off, alignment, and bonding of materials and devices. The processes involve first depositing a device layer on a sacrifical layer situated on a growth substrate. A device may be defined in the device layer. The device layer or the device is coated with a carrier layer. The sacrificial layer and/or the growth substrate are then etched away to release the combination of the device layer and the carrier layer from the growth substrate. The device layer or device can then be aligned and selectively bonded to a host substrate. Other processes and apparatus are set forth for facilitating lift-off, bonding, handling, and patterning of he device layer or device.
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Callahan John
Drabik Timothy J.
Martin Kevin P.
Clark S. V.
Crane Sara W.
Georgia Tech Research Corporation
Horstemeyer Scott A.
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