Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-04-17
2007-04-17
Picardat, Kevin M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257S717000, C257S721000, C438S122000, C438S121000, C438S123000, C438S125000
Reexamination Certificate
active
11053724
ABSTRACT:
Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that has been fabricated by such processes can have non-linear or convoluted passageways therethrough to enhance air flow. An optical recognition system may be used in conjunction with programmed material consolidation processes to ensure that a heat sink is fabricated or positioned on the appropriate location of an electronic component, such as a semiconductor device.
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Street Bret K.
Williams Vernon M.
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