Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1996-04-12
1998-05-12
Whitehead, Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257703, 257712, 257717, H01L 23053, H01L 2306, H01L 2334
Patent
active
057510598
ABSTRACT:
The invention relates to components such as pyroelectric sensors which are particularly sensitive to piezoelectric effects and which, consequently, are disturbed by the mechanical deformations or the vibrations which the component may experience. In order to limit these disturbances, it is proposed to insert, between the chip (10) carrying the pyroelectric layer and the bottom of the package (30), a flexible sheet (42) of silicone which absorbs the deformations of the package without transmitting them to the chip. Ultrasonic bonding of the connecting wires (34) is still possible despite the presence of the flexible sheet. The chip is preferably fixed to a metallized ceramic plate (40) and abutments (44) are preferably provided at the bottom of the package in order to limit the compression of the flexible sheet (42) during the bonding operation.
REFERENCES:
patent: 4383174 (1983-05-01), Matsumurra et al.
patent: 5091770 (1992-02-01), Yamaguchi
patent: 5145931 (1992-09-01), Nakayoshi et al.
Clark Jhihan B.
Thomson-CSF Semiconducteurs Specifiques
Whitehead Carl W.
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