LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for mounting a semiconductor chip and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for packaging a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for producing semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for reducing electromagnetic interference and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for semiconductor device and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for semiconductor device and semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate having specific pad distribution

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate mounting an integrated circuit package with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate subassembly for a transistor switch module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate-based chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Support elements for semiconductor devices with peripherally...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Support structure for power element

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Surface mount adapter apparatus and methods regarding same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Surface mount adapter apparatus and methods regarding same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Surface mount IC using silicon vias in an area array format or s