Substrate for packaging a semiconductor device

Details Substrate for packaging a semiconductor device Substrate for packaging a semiconductor device

1991-01-23

1993-05-25

Wojciechowicz, Edward J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257738, 257773, 257778, 257780, 257797, 437183, 437203, 437204, 437209, 437212, 29740, 29837, H01L 2348, H01L 2144

Patent

active

052143082

ABSTRACT:
A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, and a recess for receiving at least a top of the bump is formed in the electrode terminal.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 4937653 (1990-06-01), Blonder et al.

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