Substrate-based chip package

Details Substrate-based chip package Substrate-based chip package

2005-09-27

2005-09-27

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S687000, C257S704000

Reexamination Certificate

active

06949820

ABSTRACT:
The invention relates to a substrate-based chip package, comprising a substrate on which a chip is fastened by a die-attach material. The substrate is provided with a solder resist (on both sides) and, on the side that is opposite from the chip, has conductor tracks which are provided with solder balls and are connected to the chip by means of wire bridges which extend through a bonding channel which is sealed with a glob top. The chip and the substrate on the chip side being encapsulated by a molded cap.

REFERENCES:
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6667560 (2003-12-01), Goh
patent: 6724076 (2004-04-01), Kahlisch et al.
patent: 2002/0030266 (2002-03-01), Murata
patent: 199 54 888 (2001-05-01), None
patent: 0 810 655 (1997-12-01), None

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