Substrate for semiconductor package

Details Substrate for semiconductor package Substrate for semiconductor package

2005-08-23

2005-08-23

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S786000, C257S459000, C257S690000, C257S692000

Reexamination Certificate

active

06933600

ABSTRACT:
The invention provides a semiconductor package substrate, which includes a substrate, a chip contact area, an inner pad portion, an outer pad portion and a conductive layer. The chip contact area, the inner pad portion, the outer pad portion and the conductive layer are formed on one side of the substrate, wherein the outer pad portion encloses the inner pad portion that surrounds the chip contact area in the center of the substrate. The inner pad portion and the outer pad portion contain a plurality of signal pads and a plurality of shielding pads respectively, while the conductive layer and each of the shielding pads are electrically connected.

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