Substrate subassembly for a transistor switch module

Details Substrate subassembly for a transistor switch module Substrate subassembly for a transistor switch module

1994-03-09

1996-07-23

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257705, 257706, 257713, 257724, H01L 23057, H01L 23373, H01L 25065

Patent

active

055392547

ABSTRACT:
A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.

REFERENCES:
patent: 3714709 (1973-02-01), Liederbach
patent: 4538170 (1985-08-01), Yerman
patent: 4694322 (1987-09-01), Sakurai et al.
patent: 4766481 (1988-08-01), Gobrecht et al.
patent: 5297001 (1994-03-01), Sterung
patent: 5311043 (1994-05-01), Stockmeier
patent: 5347160 (1994-09-01), Sutrina
patent: 5408128 (1995-04-01), Furnival
Power Package Purges Wire Bonds & Their Inductance (Electronic Design Jul. 22, 1993 No. 15 p. 35).

Affiliated with

Also associated with

Rating

Substrate subassembly for a transistor switch module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate subassembly for a transistor switch module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate subassembly for a transistor switch module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-715079