Crosstalk reduction in electrical interconnects using...
CSP stacking technology using rigid/flex construction
CSP type semiconductor device with reduced package size
Cu-balanced substrate
Current sense element incorporated into integrated circuit packa
Current supply and support system for a thin package
Data carrier having an IC module with a protection mechanism...
Depopulation of a ball grid array to allow via placement
Device and method for electrically or thermally coupling to...
Device for electronic packaging, pin jig fixture
Device for establishing non-permanent electrical connection...
Device for establishing non-permanent electrical connection...
Device for packaging electronic components
Device having pins formed of hardened mixture of conductive meta
Device mounting board and semiconductor apparatus using the...
Device packages having a III-nitride based power...
Device, system and electric element
Devices having substrates with opening passing through the...
Devices with tape automated bonding
Die paddle for receiving an integrated circuit die in a...