Pin-assignment method for integrated circuit packages to increas
Plastic ball grid array package with strip line configuration
Plastic electronic component package
Plastic encapsulated semiconductor device having wing leads
Plastic molded IC package with leads having small flatness fluct
Plastic package for semiconductor device
Plastic packaging for a surface mounted integrated circuit
Plating tail design for IC packages
Polymer enhanced column grid array
Power converter with improved lead frame arrangement...
Power core devices and methods of making thereof
Power delivery system for integrated circuits utilizing...
Power delivery through a flex tape in decoupled I/O-power...
Power device packages and methods of fabricating the same
Power distribution pattern for a ball grid array
Power distribution plane layout for VLSI packages
Power electronic component module and method for assembling...
Power electronic package having two substrates with multiple...
Power grid wiring for semiconductor devices having voltage...
Power gridding scheme