Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-08-16
2011-08-16
Im, Junghwa M (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S686000, C257S678000, C257S723000, C257S725000, C257S734000, C257SE23071
Reexamination Certificate
active
07999369
ABSTRACT:
A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.
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Buttay Cyril
Johnson C. Mark
Malhan Rajesh Kumar
Rashid Jeremy
Udrea Florin
Denso Corporation
Im Junghwa M
Posz Law Group , PLC
The University of Sheffield
University of Cambridge
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