Plastic molded IC package with leads having small flatness fluct

Details Plastic molded IC package with leads having small flatness fluct Plastic molded IC package with leads having small flatness fluct

1996-07-31

1998-12-01

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257668, H01L 2348

Patent

active

058443070

ABSTRACT:
In a plastic molded IC package, a metal pattern and leads are formed on a first surface of an insulating layer, and a conductive pattern connected to a semiconductor chip is formed on a second surface of the insulating layer. The conductive pattern is connected to the leads via through holes in the insulating layer.

REFERENCES:
patent: 4417266 (1983-11-01), Grabbe
patent: 4445271 (1984-05-01), Grabbe
patent: 4621278 (1986-11-01), Miura
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4809135 (1989-02-01), Yerman
patent: 4949158 (1990-08-01), Ueda
patent: 5214845 (1993-06-01), King et al.
patent: 5296736 (1994-03-01), Frei et al.
patent: 5552631 (1996-09-01), McCormick

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