Insert-molded leadframe to optimize interface between...
Integrated circuit carrier and method of manufacturing and...
Integrated circuit chip package having an internal lead
Integrated circuit chip support substrate for placing in a...
Integrated circuit having a lid and method of employing a...
Integrated circuit package configuration having an...
Integrated circuit package having security feature and...
Integrated circuit package with internally readable permanent id
Integrated circuit package with permanent identification of devi
Integrated circuit package with removable shield
Integrated circuit with protective moat
Interconnect substrate, semiconductor device, methods of...
Leadframe having lead locks to secure leads to encapsulant
Leadless type semiconductor package, and production process...
Mechanically interlocking ball grid array packages and...
Method and apparatus for edge connection between elements of...
Method and apparatus for providing optoelectronic...
Method of creating shielded structures to protect...
Micro-electro-mechanical system (MEMS) package with side...
Microelectronic devices and microelectronic die packages