Micro-electro-mechanical system (MEMS) package with side...

Details Micro-electro-mechanical system (MEMS) package with side... Micro-electro-mechanical system (MEMS) package with side...

2006-07-18

2006-07-18

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S729000, C257S680000, C257S099000

Reexamination Certificate

active

07078804

ABSTRACT:
A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.

REFERENCES:
patent: 6303986 (2001-10-01), Shook
patent: 6400009 (2002-06-01), Bishop et al.
patent: 6822326 (2004-11-01), Enquist et al.
patent: 6962834 (2005-11-01), Stark
patent: 2005/0157374 (2005-07-01), Tarn

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