Search
Selected: P

Package support member with high heat-removing ability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Package, electronic device, substrate having a separation...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Plastic-packaged semiconductor integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Power semiconductor module with a connected substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Premold type semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Preventing backside analysis of an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Printed circuit board assembly with strain-alleviating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.