Integrated circuit having a lid and method of employing a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Reexamination Certificate

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Details

C257S678000, C257S712000, C257S731000, C257S787000

Reexamination Certificate

active

10805112

ABSTRACT:
The present invention relates to a lid for an integrated circuit. According to one embodiment, an integrated circuit having a lid comprises a substrate having a flat surface and extending a first length and a lid having a recess and a foot portion. The lid generally has a second length shorter than the first length, and is positioned on the flat surface of the substrate. Finally, a bonding agent is positioned on the flat surface adjacent the foot portion of the lid. According to an alternate embodiment, a second component is positioned on the substrate outside the foot portion, and an adhesive seal is positioned on the substrate adjacent the foot and covering the component. A method of securing a lid to an integrated circuit is also disclosed.

REFERENCES:
patent: 6770513 (2004-08-01), Vikram et al.
patent: 7012326 (2006-03-01), Wu et al.
U.S. Appl. No. 10/648,118, filed Aug. 25, 2003, Chee et al.
U.S. Appl. No. 10/782,184, filed Feb. 18, 2004, Wu et al.

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