Interconnect substrate, semiconductor device, methods of...

Details Interconnect substrate, semiconductor device, methods of... Interconnect substrate, semiconductor device, methods of...

2006-03-07

2006-03-07

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S723000, C257S731000, C257S688000, C257S690000

Reexamination Certificate

active

07009293

ABSTRACT:
A semiconductor device comprising a substrate. An interconnect pattern is formed over the substrate, and the substrate has a first portion and a second portion to be superposed on the first portion. The first portion has edges as positioning references. The second portion has a shape to be superposed over the first portion except the edges.

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