Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2000-03-31
2002-06-04
Everhart, Caridad (Department: 2825)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S708000, C257S710000
Reexamination Certificate
active
06400015
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the field of semiconductor device fabrication, and more specifically to a method and structure for constructing a structure using semiconductor device fabrication methods that shields semiconductor devices.
2. Discussion of Related Art
Today integrated circuits are made up of literally millions of active and passive devices such as transistors, capacitors and resistors. In order to improve overall chip performance, some devices may need to be shielded from the electromagnetic interference (EMI) from adjacent devices, from heat, and from light.
REFERENCES:
patent: 4266090 (1981-05-01), Scherer
patent: 5760455 (1998-06-01), Hierold et al.
patent: 5763824 (1998-06-01), King et al.
Doyle Brian
Fraser David
Blakely , Sokoloff, Taylor & Zafman LLP
Everhart Caridad
Intel Corporation
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