Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2007-10-30
2007-10-30
Lam, Cathy F. (Department: 1775)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S667000, C257S687000, C257S787000
Reexamination Certificate
active
10470320
ABSTRACT:
A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and the mounted IC chip are placed in an injection mold. The injection mold has two parts that surround the periphery of the substrate. One part of the injection mold defines a cavity for molding an encapsulation material thereby encapsulating the IC chip, and includes a face for bearing on the mounting face. At least one recess is provided in one part of the injection mold. The recess defines, above the mounting face, a slot for providing a vent for venting gases. The mounting face includes a region on which a metal outer layer is placed. The metal outer layer extends along the recess and on the bearing face on both sides of the recess.
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Herard Laurent
Prior Christophe
Allen Dyer Dopplet Milbrath & Gilchrist, P.A.
Jorgenson Lisa K.
Lam Cathy F.
STMicroelectronics SA
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