Integrated circuit carrier and method of manufacturing and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Reexamination Certificate

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C257S678000, C206S710000

Reexamination Certificate

active

07023087

ABSTRACT:
A process for manufacturing an integrated circuit including the steps of providing a chip carrier including a base, an inner well formed about the periphery of the base, and an outer well formed about the periphery of the inner well. An integrated circuit is positioned on the base. The process further includes the steps of pre or post processing the integrated circuit.

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patent: 5547082 (1996-08-01), Royer et al.
patent: 5964353 (1999-10-01), Hamlin
patent: 195 27 021 (1997-01-01), None
patent: 05338616 (1993-12-01), None
patent: 7 18499 (1995-03-01), None

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