Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2006-04-04
2006-04-04
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S678000, C206S710000
Reexamination Certificate
active
07023087
ABSTRACT:
A process for manufacturing an integrated circuit including the steps of providing a chip carrier including a base, an inner well formed about the periphery of the base, and an outer well formed about the periphery of the inner well. An integrated circuit is positioned on the base. The process further includes the steps of pre or post processing the integrated circuit.
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Baillie Matthew Brett
Reichl Gary John
Agere Systems Inc.
Clark S. V.
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