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Semiconductor module and electronic component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor module and method for mounting the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor module comprising semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Semiconductor module having an internal semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor module having an internal semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor module having an upper layer semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Semiconductor module having interconnected semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Semiconductor module in which a semiconductor package is...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor module including vertically mounted semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Semiconductor module with a semiconductor stack, and methods...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-chip package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Semiconductor multi-package module having inverted bump chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module having inverted land grid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module having inverted second...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module having inverted second...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module having package stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module having package stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module having wire bond...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module having wire bond...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor multi-package module including stacked-die...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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