Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2004-12-17
2008-11-25
Cao, Phat X (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257SE23085
Reexamination Certificate
active
07456495
ABSTRACT:
An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.
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Pohl Jens
Roemer Bernd
Schaetzler Bernhard
Stuempfl Christian
Vilsmeier Herman
Cao Phat X
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
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