Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2008-04-01
2008-04-01
Lee, Calvin (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C438S109000
Reexamination Certificate
active
07352057
ABSTRACT:
A semiconductor module having an internal semiconductor chip stack on a wiring substrate is disclosed. In one embodiment, the semiconductor chip stack has semiconductor chips which are arranged such that they are offset, the semiconductor chips having bonding connection pads in at least one edge region of their active top side. These bonding connection pads are electrically connected to the wiring substrate via bonding connections. In this case, the semiconductor chips are stacked on top of one another in an offset manner such that the bonding connection pads remain free of a semiconductor chip which is stacked on top of them. In this case, the semiconductor chips may be identical silicon chips which may differ, for example in pairs, in terms of their wiring structure for the centrally arranged contact areas in different edge regions.
REFERENCES:
patent: 6686663 (2004-02-01), Masuda et al.
patent: 6900528 (2005-05-01), Mess et al.
patent: 2002/033442 (2002-01-01), None
patent: 2002033442 (2002-01-01), None
patent: 2004214285 (2004-07-01), None
Grafe Jurgen
Ludewig Sylke
Thomas Jochen
Weitz Peter
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Lee Calvin
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