Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-12-06
2005-12-06
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S126000, C257S777000, C257S780000, C257S783000, C257S786000, C257S778000
Reexamination Certificate
active
06972481
ABSTRACT:
A semiconductor multi-package module having stacked first and second packages, each package including a die attached to a substrate, in which the first and second substrates are interconnected by wire bonding, and wherein at least one said package comprises a stacked die package. Also, a method for making a semiconductor multi-package module, by providing a stacked die molded first package including a first package substrate, affixing a second molded package including a second substrate onto an upper surface of the first package, and forming z-interconnects between the first and second substrates.
REFERENCES:
patent: 5373189 (1994-12-01), Massit et al.
patent: 5436203 (1995-07-01), Lin
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5550711 (1996-08-01), Burns et al.
patent: 5898219 (1999-04-01), Barrow
patent: 5903049 (1999-05-01), Mori
patent: 5977640 (1999-11-01), Bertin et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6034875 (2000-03-01), Heim et al.
patent: 6075289 (2000-06-01), Distefano
patent: 6201266 (2001-03-01), Ohuchi et al.
patent: 6201302 (2001-03-01), Tzu
patent: 6274930 (2001-08-01), Vaiyapuri et al.
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6333552 (2001-12-01), Kakimoto et al.
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6388313 (2002-05-01), Lee et al.
patent: 6400007 (2002-06-01), Wu et al.
patent: 6414381 (2002-07-01), Takeda
patent: 6424050 (2002-07-01), Komiyama
patent: 6472732 (2002-10-01), Terui
patent: 6472741 (2002-10-01), Chen et al.
patent: 6489676 (2002-12-01), Taniguchi et al.
patent: 6492726 (2002-12-01), Quek et al.
patent: 6538319 (2003-03-01), Terui
patent: 6545365 (2003-04-01), Kondo et al.
patent: 6593647 (2003-07-01), Ichikawa
patent: 6599779 (2003-07-01), Shim et al.
patent: 6621169 (2003-09-01), Kikuma et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6777799 (2004-08-01), Kikuma et al.
patent: 2002/0004258 (2002-01-01), Nakayama et al.
patent: 2002/0014689 (2002-02-01), Lo et al.
patent: 2002/0125557 (2002-09-01), Chen et al.
patent: 2002/0125558 (2002-09-01), Akram et al.
patent: 2002/0130404 (2002-09-01), Ushijima et al.
patent: 2004/0016939 (2004-01-01), Akiba et al.
patent: 05152505 (1993-06-01), None
ChipPAC, Inc.
Haynes Beffel & Wolfeld LLP
Kennedy Bill
Nelms David
Tran Mai-Huong
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