Semiconductor multi-package module having wire bond...

Details Semiconductor multi-package module having wire bond... Semiconductor multi-package module having wire bond...

2005-01-04

2005-01-04

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S706000, C257S659000, C257S660000, C257S787000, C257S778000

Reexamination Certificate

active

06838761

ABSTRACT:
A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming wire bond z-interconnects between the upper and lower substrates.

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