Semiconductor module comprising semiconductor packages

Details Semiconductor module comprising semiconductor packages Semiconductor module comprising semiconductor packages

1998-05-06

1999-05-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257685, 361730, H01L23/02

Patent

active

059030496

ABSTRACT:
Each of two semiconductor elements 1a or 1b is connected to wiring patterns 3a or 3b on an element substrate 2a or 2b via a bump 4a or 4b, respectively. These members are sealed off by sealing resin to form a semiconductor package 6a or 6b, and the same are disposed on a mounting substrate 8 one above the other with an adhesive agent 9 applied thereto. A portion of the wiring pattern 3a not covered by the sealing resin 5, which portion is connected to the semiconductor element 1a, a portion of the wiring pattern 3b connected to the semiconductor element 1b, and an electrode on the mounting substrate 8 are electrically interconnected by connecting wires 7.

REFERENCES:
patent: 5373189 (1994-12-01), Massit et al.
patent: 5631497 (1997-05-01), Miyano et al.

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