Semiconductor module including vertically mounted semiconductor

Details Semiconductor module including vertically mounted semiconductor Semiconductor module including vertically mounted semiconductor

1996-05-30

1998-03-10

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257686, 257712, 257723, H01L 2302

Patent

active

057264929

ABSTRACT:
A semiconductor module includes a plurality of elementary chip assemblies stacked with each other, wherein each of the elementary chip assemblies includes a semiconductor chip and a thermally conductive substrate supporting the semiconductor chip thereon. The elementary chip assemblies are stacked in a manner such that the bottom edge of the semiconductor chips are aligned to form a bottom surface of the semiconductor module, and interconnection electrodes are provided on the bottom surface.

REFERENCES:
patent: 5016138 (1991-05-01), Woodman
patent: 5313096 (1994-05-01), Eide

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