Semiconductor module in which a semiconductor package is...

Details Semiconductor module in which a semiconductor package is... Semiconductor module in which a semiconductor package is...

2004-04-29

2009-08-11

Pham, Hoai v (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE25006, C257SE25013

Reexamination Certificate

active

07573128

ABSTRACT:
A semiconductor module comprises: semiconductor packages each comprising a semiconductor element, a wiring substrate having a wiring member connected to the semiconductor element and external terminals connected to the wiring member, and a first organic film formed on a side of the semiconductor element opposed to a side toward the wiring substrate; and a mount substrate, on which the semiconductor element is mounted. First of the semiconductor packages and second of the semiconductor packages are stacked. Second organic films are provided between the wiring substrate of the first semiconductor package and the first organic film of the second semiconductor package and between the mount substrate and the semiconductor package.

REFERENCES:
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6583503 (2003-06-01), Akram et al.
patent: 2003/0052399 (2003-03-01), Shibata
patent: 08-236694 (1996-09-01), None
patent: 2000-286380 (2000-10-01), None
patent: 2002-176135 (2002-06-01), None

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