LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Insulating material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for integrated circuit with thermal vias and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for microwave and mm-wave integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for mounting semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for sealing an integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for sealing an integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for sealing an integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for semiconductor die containing symmetrical lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package of leadframe with heatsinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package of leadframe with heatsinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package structure for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package substrate and a flip chip mounted semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged die on PCB with heat sink encapsulant and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged integrated circuit add-on card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged integrated circuit add-on card and method of manufactur

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged semiconductor device and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged semiconductor device with external leads having anchor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged semiconductor die including heat sink with locking feat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packages base which allows mounting of a semiconductor...