Packaged integrated circuit add-on card and method of manufactur

Details Packaged integrated circuit add-on card and method of manufactur Packaged integrated circuit add-on card and method of manufactur

1993-05-27

1994-11-08

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257697, H01L 2302

Patent

active

053629850

ABSTRACT:
An add-on card which has a flat surface on the top side on which a plastic quad flat pack integrated circuit packaged integrated circuit can be soldered upon. The other side of the add-on card has downwardly protruding pins that can plug into a pin grid array integrated circuit socket. A method of manufacturing a add-on card whereby bonding pads are disposed on one side of the add-on card and pins are disposed on the other side of the add-on card.

REFERENCES:
patent: 4994903 (1991-02-01), Wroe et al.
patent: 5180097 (1993-01-01), Zenshi
patent: 5198693 (1993-03-01), Imken et al.
patent: 5298791 (1994-03-01), Liberty et al.

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