Package for mounting semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S106000, C438S127000, C438S122000, C257S706000

Reexamination Certificate

active

06975026

ABSTRACT:
A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.

REFERENCES:
patent: 4489241 (1984-12-01), Matsuda et al.
patent: 4716396 (1987-12-01), Kneifel
patent: 4849857 (1989-07-01), Butt et al.
patent: 5276586 (1994-01-01), Hatsuda et al.
patent: 5285350 (1994-02-01), Villaume
patent: 5510956 (1996-04-01), Suzuki
patent: 5650918 (1997-07-01), Suzuki
patent: 5777847 (1998-07-01), Tokuno et al.
patent: 5831836 (1998-11-01), Long et al.
patent: 5854511 (1998-12-01), Shin et al.
patent: 5891753 (1999-04-01), Akram
patent: 5905299 (1999-05-01), Lacap
patent: 6215180 (2001-04-01), Chen et al.
patent: 6285079 (2001-09-01), Kunikiyo
patent: 6288900 (2001-09-01), Johnson et al.
patent: 6547076 (2003-04-01), Pylant
patent: 6661661 (2003-12-01), Gaynes et al.
patent: 4-206858 (1992-07-01), None
patent: 8-17951 (1996-01-01), None
patent: 11-67998 (1999-03-01), None
patent: 2000-91474 (2000-03-01), None
patent: 2001-57402 (2001-02-01), None
patent: 2001-68512 (2001-03-01), None
Korean Office Action dated Mar. 30, 2005.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Package for mounting semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for mounting semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for mounting semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3492895

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.