Packaged semiconductor device with external leads having anchor

Details Packaged semiconductor device with external leads having anchor Packaged semiconductor device with external leads having anchor

1995-11-06

1996-07-30

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257669, 257690, 257710, 257794, H01L 2312

Patent

active

055414516

ABSTRACT:
A semiconductor device has a semiconductor chip and a ceramic envelope consisting of a base portion and a sealing portion sealing the chip, and has good high-speed operability, radiation properties and electric characteristics. Leads made of Cu and electrically connected to the semiconductor chip are held between the base portion and the sealing portion, and have anchor holes formed in the portions thereof held therebetween. A glass-based adhesive is coated in the anchor holes, between the held portions of the leads and the base portion, and between the held portions and the sealing portion.

REFERENCES:
patent: 4607276 (1986-08-01), Butt
patent: 4725692 (1988-02-01), Ishii et al.

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