Packaged die on PCB with heat sink encapsulant and methods

Details Packaged die on PCB with heat sink encapsulant and methods Packaged die on PCB with heat sink encapsulant and methods

2005-02-08

2005-02-08

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S778000, C257S712000, C257S713000, C257S720000, C257S722000, C438S107000, C438S108000, C438S715000

Reexamination Certificate

active

06853069

ABSTRACT:
An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface (“opposing surface”) opposite the surface attached to the substrate to form a wall around a periphery of the opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface of the semiconductor chip.

REFERENCES:
patent: 4143456 (1979-03-01), Inoue
patent: 4264917 (1981-04-01), Ugon
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4358552 (1982-11-01), Shinohara et al.
patent: 4507675 (1985-03-01), Fujii et al.
patent: 4642671 (1987-02-01), Rohsler et al.
patent: 4801998 (1989-01-01), Okuaki
patent: 4931852 (1990-06-01), Brown et al.
patent: 4961107 (1990-10-01), Geist et al.
patent: 5051275 (1991-09-01), Wong
patent: 5101465 (1992-03-01), Murphy
patent: 5144747 (1992-09-01), Eichelberger
patent: 5173764 (1992-12-01), Higgins, III
patent: 5194930 (1993-03-01), Papathomas et al.
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5379186 (1995-01-01), Gold et al.
patent: 5394303 (1995-02-01), Yamaji
patent: 5434105 (1995-07-01), Liou
patent: 5436203 (1995-07-01), Lin
patent: 5450283 (1995-09-01), Lin et al.
patent: 5488254 (1996-01-01), Nishimura et al.
patent: 5489538 (1996-02-01), Rostoker et al.
patent: 5489801 (1996-02-01), Blish, II
patent: 5552635 (1996-09-01), Kim et al.
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5656857 (1997-08-01), Kishita
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5866953 (1999-02-01), Akram et al.
patent: 6252308 (2001-06-01), Akram et al.
patent: 6534858 (2003-03-01), Akram et al.
patent: 52-77684 (1977-07-01), None
patent: 60-94744 (1985-05-01), None
patent: 60-178651 (1985-09-01), None
patent: 4-157758 (1992-05-01), None

Affiliated with

Also associated with

Rating

Packaged die on PCB with heat sink encapsulant and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaged die on PCB with heat sink encapsulant and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged die on PCB with heat sink encapsulant and methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3511833