Package for microwave and mm-wave integrated circuits

Details Package for microwave and mm-wave integrated circuits Package for microwave and mm-wave integrated circuits

1998-12-21

2000-10-31

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257728, H01L 2312

Patent

active

061406988

ABSTRACT:
A microwave integrated circuit package is disclosed. The package consists of a package substrate, having conductive vias, at least one ground plane, and conductive transmission lines; a semiconductor die electrically and mechanically connected to the top surface of the package substrate; a continuous outer wall attached to the top surface of the package substrate and at least one interior wall at a distance from a second wall, which may be the outer wall; a lid; at least one of the transmission lines passing under the interior wall and the second wall carrying a signal of frequency F; and an impedance transformer on the transmission line between the interior wall and the second wall. In operation, the interior wall, the distance between the interior wall and the second wall and the impedance transformer cancel the discontinuity caused by the second wall whereby the reflection of the signal caused by the transmission line passing under the walls is greatly diminished.

REFERENCES:
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patent: 5448826 (1995-09-01), Goetz et al.
patent: 5451818 (1995-09-01), Chan et al.
patent: 5543663 (1996-08-01), Takubo
patent: 5554824 (1996-09-01), Ueda et al.
patent: 5574314 (1996-11-01), Okada et al.

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